SAE AMS3686
Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315°C (519°F).
This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste. This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range -55 degrees to +315 degrees C (-67 degrees to +600 degrees )F.
History:Standard | Published | Revision | Status |
---|---|---|---|
AMS3686A | 1991-10-01 | Latest | |
AMS3686 | 1975-09-01 | Historical |