SAE AIR1141

1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits(Cancelled Dec 1971)

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Standard:
  • AIR1141
Issued:
  • 1971-12-01
Issuing:
  • Ae-8b3 Relays Committee
History:
StandardPublishedRevisionStatus
AIR11411971-12-01LatestCancelled
AKA:
  • SAE AIR 1141
Sector:
  • Aerospace
Topic:
  • Electrical Systems

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