• AMS3690

• 1960-01-01

• Historical. Access the latest revision: AMS3690C

• Ams P Polymeric Materials Committee

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.

• SAE AMS 3690

• Aerospace

• Adhesives and Sealants
• Fabrics
• Polymers
• Materials properties
• Textiles