NASA MSFC SPEC 411:1966

NASA MSFC SPEC 411:1966 Adhesive, Epoxy Resin Establishes the requirements for epoxy resin adhesives intended for structural bondings on printed circuit boards, components, and connectors.

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Table of Contents

1.SCOPE
2.APPLICABLEDOCUMENTS
3.REQUIREMENTS
4.QUALITYASSURANCEPROVISIONS
5.PREPARATIONFORDELIVERY
6.NOTES

Abstract

Establishes the requirements for epoxy resin adhesives intended for structural bondings on printed circuit boards, components, and connectors.

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