SAE AMS3690C
Adhesive Compound, Epoxy, Room Temperature Curing.
Standard:
AKA:
- AMS3690
- Revision: C
- 2009-07-20
- Ams P17 Composite Materials Committee
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
History:| Standard | Published | Revision | Status |
|---|---|---|---|
| AMS3690C | 2009-07-20 | Latest | |
| AMS3690B | 1993-01-01 | Historical | |
| AMS3690A | 1986-04-01 | Historical | |
| AMS3690 | 1960-01-01 | Historical |
- SAE AMS 3690
- Aerospace
- Adhesives and Sealants
- Composite materials
- Fabrics
- Fibers
- Glass
- Lightweight materials
- Resins
- Materials properties