SAE AMS3692C
Adhesive Compound, Epoxy Resin, High Temperature Application.
Standard:
AKA:
- AMS3692
- Revision: C
- 2005-05-31
- 1995-02-01
- Ams P17 Composite Materials Committee
This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.
This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
History:| Standard | Published | Revision | Status |
|---|---|---|---|
| AMS3692C | 1995-02-01 | Latest | |
| AMS3692B | 1993-01-01 | Historical | |
| AMS3692A | 1986-04-01 | Historical | |
| AMS3692 | 1960-01-01 | Historical |
- SAE AMS 3692
- Aerospace
- Adhesives and Sealants
- Composite materials
- Fabrics
- Fibers
- Glass
- Lightweight materials
- Resins
- Materials properties