SAE AMS3690B
Adhesive Compound, Epoxy, Room Temperature Curing.
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.
History:Standard | Published | Revision | Status |
---|---|---|---|
AMS3690C | 2009-07-20 | Latest | |
AMS3690B | 1993-01-01 | Historical | |
AMS3690A | 1986-04-01 | Historical | |
AMS3690 | 1960-01-01 | Historical |