SAE AMS3690B

Adhesive Compound, Epoxy, Room Temperature Curing.

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$29.92 tax incl.

$68.00 tax incl.

(price reduced by 56 %)

1000 items in stock

Standard:
  • AMS3690
  • Revision: B
Reaffirmed:
  • 2000-12-01
Revised:
  • 1993-01-01
Revision:
  • Historical. Access the latest revision: AMS3690C
Issuing:
  • Ams P Polymeric Materials Committee
Scope:

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.

History:
StandardPublishedRevisionStatus
AMS3690C2009-07-20LatestRevised
AMS3690B1993-01-01HistoricalReaffirmed
AMS3690A1986-04-01HistoricalReaffirmed
AMS36901960-01-01HistoricalIssued
AKA:
  • SAE AMS 3690
Sector:
  • Aerospace
Topic:
  • Adhesives and Sealants
  • Fabrics
  • Polymers
  • Materials properties
  • Textiles

Contact us