SAE ARP1612A
Polyamide Printed Circuit Boards Fabrication Of.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyamide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards. The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.
History:Standard | Published | Revision | Status |
---|---|---|---|
ARP1612A | 1990-01-01 | Latest | |
ARP1612 | 1979-10-01 | Historical |